Micromachining along a curve: Femtosecond laser micromachining of curved profiles in diamond and silicon using accelerating beams.
Fiche publication
Date publication
août 2012
Auteurs
Membres identifiés du Cancéropôle Est :
Dr FROEHLY Luc
Tous les auteurs :
Mathis A, Courvoisier F, Froehly L, Furfaro L, Jacquot M, Lacourt PA, Dudley JM
Lien Pubmed
Résumé
We report femtosecond laser micromachining of micron-size curved structures using tailored accelerating beams. We report surface curvatures as small as 70 mu m in both diamond and silicon, which demonstrates the wide applicability of the technique to materials that are optically transparent or opaque at the pump laser wavelength. We also report the machining of curved trenches in silicon. Our results are consistent with an ablation-threshold model based on calculated local beam intensity, and we also observe asymmetric debris deposition which is interpreted in terms of the optical properties of the incident accelerating beam. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4745925]
Référence
. 2012 Aug 13;101(7):071110.